Samsung shipping 40nm 32GB memory module for servers

WOW! Samsung is now shipping 32GB memory modules based on 40nm fabrication process! In fact the Korean semiconductor major is the first one in the world to ship 32GB memory module based on 40nm class. Targeted towards servers, the module provide high-density and high-performance features at low-power consumption levels.


The highly-efficient 32GB RDIMM consists of 36 dual-die 40nm-class 4Gb DDR3 chips that can perform at equal or greater levels to a 40nm-based 16GB RDIMM with no increase in power consumption.

By equipping a dual CPU, two-way server with 32GB modules, a server system can have up to 384GB of memory. This allows for doubling the previously largest density of 192GBs per server with a power increase of less than five percent over that needed for a 16GB module-based system.

In addition, replacing 12 DRAM modules of 16GB density with just six 32GB modules would achieve a 192GB total density, while allowing the DRAM operating speed in a two-way server system to rise by 33 percent from 800 megabit per second (Mbps) to 1,066Mbps, as power is cut by 40 percent.

In high-performance, four-way servers using 16GB modules, one terabyte of DRAM would be commonplace. By using 32GB RDIMMs, Samsung is moving toward providing four-way servers with 2TB of DRAM each, a migration that it believes will spur introduction of diverse software and a broader scale of server applications.

Mass production of the 32GB RDIMM is slated to begin next month.